为保证多功能结构内部电子元器件和设备的热可靠性,以及对温度变化的适应能力,利用ANSYS软件中的热分析模块对弹载多功能结构样机——远置单元,进行热传导分析和热应力分析,验证其结构设计的合理性,从而为电子设备的热设计从理论上提供设计依据。通过对样机在上电情况下进行温度循环实验和温度老炼试验,可知样机工作稳定,结构设计合理。

In order to ensure thermal reliability and adaptability to temperature change of the internal electronic components and equipment with multi functional structure, the thermal analysis module was used in ANSYS software to make the analysis of heat conduction and thermal stress analysis for RTU of prototype with multi functional structure used on cartridge, and the rationality of the structure design was verified, which laying the design foundation for thermal design of electronic equipment in theory. Through research on prototypes about circulation experiment in power and the temperature burn in test, it is known that the prototype works steadily and the structural design is reasonable.