电子吊舱内部设备散热问题一直是吊舱设计的关键问题之一。文中根据飞机包线选取不同高度和速度下的典型状态,通过简化吊舱及冷却系统建立网格模型,计算不同状态下吊舱内外场气动特性,得到相应状态的流场数据;将流场数据导入热力学计算模型,获得不同状态下吊舱内部芯片安装板的温度场,进而分析吊舱内部散热性能。结果表明:吊舱高空飞行较低空飞行散热效果更好,低速飞行相比高速飞行散热效果更好;通风道内各芯片板之间温差不大,温度最高为321 K,满足内部电子设备散热要求,散热性能良好。

The heat dissipation problem of internal equipment in electronic pods has always been one of the key issues in pod design. This calculation states are selected under different altitude and speed states based on flight envelope. The grid model is established by simplifying the pod and cooling system. The internal ventilation duct and external aerodynamic characteristics of the pod under different states are calculated and analyzed and the corresponding flow field data are obtained. The flow field data are imported into the thermodynamic calculation model to obtain the temperature field of the chip mounting plate inside the pod under different states. And then the thermal dissipation performance inside the pod is analyzed. The results show that the cooling effect of the pod during high-altitude fight is better than that during low-altitude fight. And compared to high-speed flight, low-speed flight has better heat dissipation effect. The temperature difference between the chip mounting plates in ventilation duct is not significant, with a maximum temperature of 321 K, which meets the heat dissipation requirements of internal electronic equipment.