To study change and reasons of storage performance of fuze electronic delayer and locate degradation or failure components, an accelerated test was launched with two electronic delayer samples of real-world-storage close to guarantee period. The probable failure components, ceramic capacitor and transistors were found out through circuit simulation. Temperature imbalance distribution leads to different interlayer expansion rate of ceramic capacitor and the wire bonding interface crack of transistors expands under temperature and humidity stress cycle. The result shows that through accelerated test and circuit simulation, the failure components can be found and the causes of the degradation can be analyzed.